CareerPlan

Principal DRAM Process Pathfinding - Dry Etch

Boise, Idaho, United States of AmericaFull-time2026-11-03 → 2026-11-10

Core

Lead dry etch process development and optimization for current and future semiconductor technology nodes.

Role type

Principal Semiconductor Process Engineer (Dry Etch)

Builds

Dry etch processes and technology roadmaps for DRAM and advanced CMOS nodes

Domain

Semiconductor manufacturing / Plasma etch

Required skills

Dry etch process development, ICP/CCP tool expertise, plasma physics, cross-functional team leadership, defect resolution, technology roadmap planning

Preferred skills

Advanced CMOS/DRAM technology, statistical process control, equipment vendor management, AI-assisted analytics

Technologies

ICP, CCP, RF sources, dry etch reactor technologies

Responsibilities

Lead development and optimization of dry etch processes to meet structural and electrical specifications; Partner with process integration teams to influence integration flows and technology roadmaps; Lead cross-functional task forces to resolve complex structural, process, defect, and hardware challenges; Develop and present process and technology roadmaps for current and future nodes; Serve as a technical resource and mentor for dry etch engineers

Seniority

Principal, hands-on IC with mentorship