ATE PROCESS ENGINEER – WP
Core
Manage and track DRAM technology transfer projects to meet deliverables and schedules, ensuring compliance with safety policies and GCP matching.
Role type
ATE Process Engineer (Technology Transfer)
Builds
DRAM technology transfer projects, tool matching, and volume manufacturing ramp
Domain
Semiconductor manufacturing (DRAM)
Required skills
Wet process engineering, DRAM technology transfer, PRD/TRD data analysis, CEERB processes, tool matching, advanced technology node ramp, process data analysis, multi-fab alignment
Preferred skills
None stated
Technologies
None stated
Responsibilities
Ensure work complies with Micron safety policies while managing and tracking DRAM technology transfer projects for assigned areas to meet deliverables and schedules. Build strong collaboration with sending Fab teams and MCT through regular communication. Partner with PE, PIE, ME, and Fab Area Leadership to close gaps for technology qualification and volume manufacturing ramp. Drive alignment projects to improve transfer, startup, yield, quality, and ramp performance. Develop area specific project and communication plans. Lead new node Value Engineering projects and Tool Evaluations. Ensure GCP matching with the sending site. Coordinate with the sending site on tool release plans, process mismatches, and CEERB items, enforcing CEERB requirements so SWAP/RR lots run only after PRD sign off with conditional sign offs allowed only when NG SWAP metrics apply. Apply tool matching strategies for reuse tools using sister site and CEERB guidance. Oversee area specific projects to meet timelines and requirements, completing Transfer Expectations on time—including tool selection, VMP matching, wafer requirements, and SWAP planning. Capture lessons learned from current and recent DRAM technologies and implementing effective mitigation plans. Accommodate incoming process and hardware changes with PE, PIE, ME, SPMO, and Planning teams. Coordinate with Procurement and IQC to ensure FOAK materials readiness.
Seniority
Mid-level, hands-on IC