Equipment Development Engineer – Wafer Bonding - Technology Development Group
Core
Develop next-generation, first-of-a-kind wafer bonding equipment from concept to hardware, solving difficult technical problems to enable future semiconductor manufacturing.
Role type
Senior IC Equipment Development Engineer (Wafer Bonding)
Builds
FAOK wafer bonding equipment, hardware, and subsystems for Micron's technology development and manufacturing
Domain
Semiconductor manufacturing equipment (Wafer Bonding)
Deliverable
production ML models
Required skills
Precision alignment, overlay control, wafer bonding mechanics, controls engineering, mechanical systems design, automation, equipment data analysis, modeling/simulation, AI-enabled troubleshooting
Preferred skills
Wafer-to-wafer fusion/hybrid bonding, motion control, Python/MATLAB, SECS/GEM, sensors, FEA, DOE, PCA, supplier management, MS/PhD
Technologies
Python, MATLAB, SECS/GEM, FEA tools, AI workflows
Responsibilities
Develop new equipment and subsystems with suppliers; own equipment performance, capability, reliability, and productivity; drive improvements in overlay, alignment, and defectivity; develop requirements, budgets, and experiments; lead evaluations, installations, and qualifications; define equipment roadmap; present technical strategies; mentor engineers.
Seniority
Senior, hands-on IC with technical ownership