Engineer, MTB PCE
Core
Perform material characterization, testing method development, supplier quality investigations, failure analysis, and statistical analysis for semiconductor packaging materials.
Role type
Senior IC materials engineer (semiconductor packaging)
Builds
Material characterization methods, quality control systems, failure analysis reports, and digital quality monitoring solutions for memory and storage products.
Domain
Semiconductor manufacturing / Materials Science
Required skills
DSC, TGA, DMA, TMA, Rheometer, Contact Angle, Density analysis; Root cause analysis; DOE design; Statistical analysis; Supplier quality management; Failure analysis; SOP development; Data science tools
Preferred skills
AI-driven quality monitoring; Digital transformation; Cross-functional collaboration
Technologies
DSC, TGA, DMA, TMA, Rheometer, Contact Angle, Density, MSA, SPC, DOE, AI tools
