MTB Assembly Equipment Engineer
Core
Engineer MTB assembly equipment using AI-enabled methods to improve utilization, yield, and manufacturing efficiency.
Role type
Senior IC semiconductor equipment engineer (AI-enabled manufacturing)
Builds
Semiconductor memory and storage manufacturing equipment and processes
Domain
Semiconductor manufacturing (DRAM, NAND, NOR)
Deliverable
production ML models
Required skills
Semiconductor equipment engineering, AI-enabled troubleshooting, data-driven root cause analysis, process validation, supplier quality management, FDC/RMS/APC/SPC systems, predictive maintenance, digital transformation
Preferred skills
Microsoft Copilot, Generative AI, advanced analytics tools, site-to-site best practice transfer
Technologies
Microsoft Copilot, Generative AI, FDC, RMS, APC, SPC, AI-driven analytics
Responsibilities
Leverage AI tools to improve equipment utilization and yield; utilize AI data analysis to predict failures and optimize maintenance; apply AI-assisted techniques for root cause analysis; coordinate equipment and material evaluations; lead utilization and yield enhancement initiatives; validate new processes for NPI; support FDC/RMS/APC/SPC systems; drive digital transformation; manage supplier quality; support audits and compliance.
Seniority
Senior, hands-on IC