CareerPlan

半導体エンジニア(2027・2028年卒/既卒歓迎)|Semiconductor Engineer – Class of 2027/2028 & Recent Graduates

Hiroshima, JapanFull-time2026-10-09 → 2026-11-10

Core

Develop and optimize semiconductor manufacturing processes, equipment, and product evaluation for memory and storage solutions.

Role type

Manufacturing and Technology Development Engineer (Semiconductor)

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing and device engineering

Required skills

Semiconductor process knowledge, equipment operation, data analysis, problem-solving, chemical reaction optimization, device structure analysis

Preferred skills

AI tool usage, cleanroom environment management, thin-film deposition, dry etching

Technologies

DRAM, CMOS transistors, capacitors, specialized testers

Responsibilities

Optimize chemical reactions and operating conditions for production, analyze causes of defects and out-of-spec issues, measure and analyze performance indicators like speed and power consumption, propose productivity improvements, manage quality assurance tasks

Seniority

Entry-level (Class of 2027/2028 & Recent Graduates)