Principal Engineer – PD Adv Dry Etch
Core
Leading dry etch technology and critical module development for Next Generation NAND research and development.
Role type
Principal Engineer (Member of Technical Staff) – Semiconductor Process Engineering
Builds
Dry etch processes, equipment roadmaps, and technology solutions for NAND products.
Domain
Semiconductor manufacturing, specifically NAND flash memory and dry etch physics.
Required skills
Dry etch process development, plasma physics and chemistry, statistical process control, cross-functional leadership, problem solving, supplier management, scalability analysis, AI tool integration.
Preferred skills
Data science basics, Python coding, AI literacy, experience with RF sources and tailored pulsing schemes.
Technologies
RF sources, SAS software (JmP), Python, AI-enabled tools.
Responsibilities
Develop/innovate dry etch processes to meet structural and electrical specifications; Collaborate with hardware teams to build equipment roadmap; Demonstrate authority on dry etch technology fundamentals; Lead cross functional teams to solve complex structural problems; Present process and technology roadmaps; Mentor less experienced engineers.
Seniority
Principal, hands-on IC with strategic leadership.