Principal Engineer, PD SG Thin Film (CVD/Diffusion)
Core
Define and implement technical strategy for structural and electrical film process development, leading multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures/devices.
Role type
Principal Engineer, Thin Film Process Development (CVD/Diffusion)
Builds
High-density NAND memory devices and storage products
Domain
Semiconductor manufacturing / Memory and storage
Required skills
Thin film deposition (ALD/CVD), Process design and optimization, Advanced characterization (XRR, ellipsometry, SEM, TEM, SIMS, XPS), Electrical evaluation, SPC/DOE/data analytics, Novel chemistry/materials/hardware solutions, Root cause analysis, Technology transfer and ramp-up, Cost reduction and yield improvement, Mentorship
Preferred skills
Competitive benchmarking, Industry trend assessment, AI tool integration
Technologies
ALD, CVD, XRR, Ellipsometry, SEM, TEM, SIMS, XPS, SPC, DOE
Responsibilities
Define and implement technical strategy for structural and electrical film process development aligned to business and technology objectives; Lead multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures/devices; Oversee end-to-end development of process modules with focus on manufacturability, scalability, and integration readiness; Resolve complex technical challenges with significant business implications; Drive technology transfer and ramp-up activities to enable transition from R&D to high-volume manufacturing; Lead cost reduction, yield improvement, and reliability enhancement programs; Mentor senior engineers and influence technical direction across the organization.
Seniority
Principal, strategy & mentorship