Technical Program Manager II (6375)
Core
Lead flexible and rigid circuit board design releases and builds for next-generation wearable devices from early design through production.
Role type
Senior Technical Program Manager (Hardware/PCB)
Builds
Flexible circuits, multi-layer boards (MLBs), and compact wearable products
Domain
Consumer electronics / Wearables / Hardware manufacturing
Required skills
PCB design and fabrication, SMT and FATP build management, APAC contract manufacturer engagement, schedule and yield optimization, cross-functional hardware program leadership
Preferred skills
Wearables or AR wearable device development, compact form factor integration, advanced PCB fabrication techniques
Technologies
SMT, FATP, PCB fabrication, flexible circuits, multi-layer boards
Responsibilities
Own design releases for flexible circuits and multi-layer boards from early design through production; Manage PCB fabrication end to end from schematics to vendor approval; Manage SMT and Final Assembly, Test, and Pack (FATP) builds; Engage directly with APAC contract manufacturers; Track schedules and highlight risks throughout development
Seniority
Senior, hands-on IC
