CareerPlan

HBM PROCESS ENGINEER

Taichung City, Taichung City, TaiwanFull-time2026-10-05 → 2026-11-11

Core

Leverage AI and advanced analytics to identify process variation, deploy predictive models, and optimize semiconductor manufacturing processes.

Role type

Senior IC HBM Process Engineer (AI/ML focus)

Builds

High-performance memory and storage solutions (DRAM, NAND, NOR)

Domain

Semiconductor manufacturing (HBM assembly/backend)

Deliverable

production ML models

Required skills

AI/ML model development, anomaly detection, digital twin creation, data mining, root cause analysis, process optimization, experiment design

Preferred skills

Semiconductor assembly/backend experience, knowledge of lamination/lapping/grinding/laser dicing

Technologies

Copilot, Power BI, AI Agents, digital twins, machine learning frameworks

Responsibilities

Develop AI-assisted monitoring and predictive models, automate engineering analysis workflows, partner with Automation/IT/Data Science teams, establish digital twins for equipment health, lead AI adoption initiatives

Seniority

Mid-level, hands-on IC