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Senior System Design Architect

Taipei, Taipei City, TaiwanFull-time2026-10-24 → 2026-11-10

Core

Design and develop motherboards, add-in cards, and modules for Qualcomm's new AI System on Chip (SoC) and System in Package (SIP) for next-generation liquid-cooled data centers.

Role type

Senior System Design Architect (Hardware)

Builds

Rack-level AI inference solutions, motherboards, and server/networking switch integration for data centers.

Domain

Semiconductor hardware engineering, data center infrastructure, AI accelerators.

Deliverable

production ML models

Required skills

System design, hardware engineering, cross-functional team leadership, platform compliance, signal integrity analysis, thermal management, mechanical design, high-speed I/O interconnects, SoC/IP integration.

Preferred skills

Experience with PCIe add-in cards, modular systems, liquid cooling (DLC), high TDP CPU/GPU/AI accelerator integration, connector and retention design, blind mate electrical design.

Technologies

SoC, SIP, PCIe, HBM, DIMM, liquid cooling, high-speed I/O.

Responsibilities

Work with cross-functional teams (thermal, SI, PTE, regulatory, validation, manufacturing) and ODMs from concept to production; support rack-level design and integration of cards, servers, and networking switches; address mechanical implications of high TDP components and thermal needs; design for signal integrity, connector placement, and cable routing.

Seniority

Senior, hands-on IC