Sr. Director, AI Technology & Manufacturing
Core
Lead Qualcomm's datacenter and module technology and manufacturing agenda, building an integrated roadmap for silicon, packaging, substrates, memory, power, and thermal management to support expansion into new markets.
Role type
Sr. Director, Hardware Engineering & Manufacturing Strategy
Builds
Integrated technology and manufacturing roadmap for datacenter and automotive silicon, packaging, and test capabilities
Domain
Semiconductor manufacturing, datacenter hardware, advanced packaging
Required skills
semiconductor product development, advanced packaging, system-level test, thermal management, supply chain assurance, capacity planning, supplier ecosystem management, cross-functional leadership, strategic roadmap development, make-versus-buy decisions
Preferred skills
datacenter industry leadership, rack-scale infrastructure knowledge, server-class system delivery, foundry/OSAT/substrate relationships, multi-year capacity negotiations
Technologies
QCM, HBM, EMIB, SI/PI, OSAT, CM, substrates, memory
Responsibilities
Lead datacenter and module technology and manufacturing agenda; Develop and own an integrated STCO roadmap; Drive qualification through scale for key datacenter technologies; Secure required capacity across advanced-node wafer, substrates, and memory; Execute supply-chain assurance investment; Lead stand-up and scaling of datacenter test capability; Create strong alignment across GMTO, Datacenter BU, and Engineering organizations
Seniority
Senior, hands-on IC
