Engineer, Staff_Customer Engineering_Power&Thermal
Core
Staff-level Customer Engineering role leading Power and Thermal software solutions, system power management, and low-power architecture across Qualcomm Snapdragon platforms and multi-OS environments.
Role type
Staff-level Customer Engineering (Power & Thermal)
Builds
Embedded software solutions for Snapdragon platforms including Android, Linux, QNX, and multi-OS virtualized stacks
Domain
Semiconductor / Mobile Computing / Embedded Systems
Required skills
Linux power management frameworks, Android power management, thermal management, hypervisor power interactions, system suspend/resume flows, root-cause analysis, log analysis, hardware-level debugging, SoC register analysis, workload characterization, technical training
Technologies
Android, Linux (LV/Yocto), QNX, HLOS, non-HLOS, hypervisor, TrustZone, AOP, RPMh, LPASS/ADSP, DSPs, NSP
Responsibilities
Lead troubleshooting of complex Power and Thermal software issues across multiple Snapdragon platforms and OS environments; Provide power and thermal design recommendations for customer applications and system architectures; Perform power and thermal characterization for platform-specific workloads including AI, multimedia, and automotive TDP use cases; Conduct technical training and workshops for customers and partners; Mentor junior engineers on Power and Thermal software and system debugging.
Seniority
Staff, technical leadership & mentorship
