EDT - FY27 Intern - Engineering Internship 2027 - 6 months, Cork
Core
Engineering intern working on cutting-edge IP for Snapdragon chipsets across Digital, Analog, and Embedded Software Design & Verification teams.
Role type
Engineering Intern (ASIC/SoC Design & Verification)
Builds
IP for encryption, power control, graphics, contextual awareness, debug, processing, analog sensing, high-speed connectivity, and embedded software.
Domain
Semiconductor / Mobile SoC Design
Required skills
Verilog, VHDL, C/C++, Python, Tcl/Perl/shell-scripting, System Verilog, OVM, UVM, FPGA design, Low Power Design, Analog Integrated Circuits, wireless/wired communications protocols, graphics/video multi-media, ARM processors, security algorithms
Preferred skills
Circuits and Electronics, Signals and systems, Microelectronic Devices and Circuits, Semiconductor Devices, Feedback systems, Digital Integrated Circuits, Digital Signal Processing, Low power VLSI, Semiconductor Physics, Software Programming
Technologies
FinFET silicon nodes (5nm and below), Windows, Office, Visio
Responsibilities
Work directly with architecture, software, measurement, and SoC teams; develop skills relevant to ASIC and SoC development in advanced CMOS processes.
Seniority
Intern
