Principal Engineer (Advance Data Analytics), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering
Core
Leading a team of engineers to build predictive models for screening, dispositioning, and testing High Bandwidth Memory (HBM) in high-volume manufacturing.
Role type
Principal Engineer (People Manager & Technical Lead)
Builds
Intelligent systems for engineering productivity, predictive yield/reliability models, and scalable data pipelines for HBM manufacturing.
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM) / Predictive Analytics (via careerplan.io/jobs/44610160-principal-engineer-advance-data-analytics-heterogeneous-integration-grouphig-high-bandwidt)
Deliverable
production ML models
Required skills
People leadership and team management, Gradient-boosted tree methods (XGBoost, LightGBM, CatBoost), Time-series and temporal modeling, Production ML deployment and monitoring, Large-scale data pipeline development, Python and SQL proficiency, Cloud platform experience (GCP, AWS, Azure), GenAI and agentic systems application.
Preferred skills
Semiconductor manufacturing domain expertise, Wafer probe and final test electrical data experience.
Technologies
Python, SQL, XGBoost, LightGBM, CatBoost, PySpark, BigQuery, pandas, scikit-learn, matplotlib, plotly, GCP, AWS, Azure.
Responsibilities
Mentor and develop team members, set technical direction and review modeling work, own design and productization of predictive yield and reliability models, build and operate model deployment paths with drift control, develop scalable data pipelines for heterogeneous datasets, apply GenAI for failure triage and automation, partner with cross-functional teams to translate engineering problems into AI solutions.
Seniority
Principal, hands-on IC with people management responsibilities
