Equipment Engineer (CMP)
Core
Maintain, troubleshoot, and optimize Chemical Mechanical Polishing (CMP) equipment for high-volume semiconductor manufacturing to drive yield and productivity.
Role type
Equipment Engineer II (CMP)
Builds
300mm semiconductor wafers
Domain
Semiconductor manufacturing / Chemical Mechanical Polishing
Deliverable
production ML models
Required skills
Troubleshooting, root cause analysis, SPC, FDC, statistical analysis, data-driven decision making, equipment maintenance, process integration
Preferred skills
Experience with EBARA 300X and Applied Materials LK Prime platforms, equipment installation and qualification, reliability improvement, leading cost reduction projects, developing Agentic AI workflows
Technologies
8D, FMEA, SPC, FDC, Agentic AI (via careerplan.io/jobs/44606116-equipment-engineer-cmp-at-micron)
Responsibilities
Maintain and optimize CMP equipment for high-volume production; Troubleshoot equipment issues using structured problem-solving methods; Support tool installations, qualifications, and process integration; Analyze equipment and process data to identify performance gaps; Develop and maintain maintenance procedures and troubleshooting guides; Partner with vendors to improve equipment performance.