Lead Engineer, Yield Analysis
Core
Lead yield analysis for semiconductor fab modules by identifying root causes of yield excursions, developing actionable yield paretos, and driving sustainable yield improvements through data-driven guidance.
Role type
Lead Engineer, Yield Analysis (Semiconductor Manufacturing)
Builds
Yield improvement strategies and data-driven corrective actions for memory and storage product manufacturing
Domain
Semiconductor manufacturing (NAND/DRAM) and data analytics
Required skills
Module-based data analysis, statistical and data-mining techniques, root cause analysis, yield pareto generation, inline correlation study, scripting for data extraction, defect and metrology knowledge, process integration knowledge
Preferred skills
AI-assisted tool integration, new part setup activities, wafer/dice/tile shading analysis, ECATS metric quantification, layout optimization, transfer documentation from R&D to manufacturing
Technologies
Query languages, scripting languages, AI-assisted tools, inline monitoring systems, probe signature analysis tools
Responsibilities
Lead training and development programs for direct reports; track probe yield performance and trends; perform advanced data analysis to quantify yield issues; collaborate with PI, PE, EFA, and PFA teams to correlate signals and findings; discover yield issues in NAND development; initiate data mining and correlation studies; develop unique parametric/probe bins to detect new fail modes; optimize existing layout and develop innovative solutions; automate data extraction from databases.
Seniority
Lead, hands-on IC with mentorship responsibilities