RDA Engineer Advanced DRAM
Core
Analyze defect data and equipment signals to identify root causes, drive yield improvement, and enable technology transfer for advanced DRAM processes.
Role type
Advanced DRAM RDA Engineer (Yield & Defect Analysis)
Builds
Inline yield characterization solutions for High Bandwidth Memory (HBM) and advanced DRAM technologies.
Domain
Semiconductor manufacturing / DRAM process integration
Deliverable
production ML models | product features | dashboards & analysis | client delivery
Required skills
Device Physics, Design of Experiments (DOE), Statistical Process Control (SPC), Semiconductor Metrology, Scanning Electron Microscopy (SEM), X-ray Metrology, Optical Inspection Systems, Python coding and scripting
Responsibilities
Analyze process challenges using defect data and equipment signals to identify root causes and improvement opportunities. Collaborate with cross-functional teams to deliver solutions with global impact. Develop comprehensive understanding of process flows, failure modes, and detection strategies via FMEA. Define die loss paretos and partner with teams to design, execute, and analyze experiments to resolve yield limitations. Monitor baseline inline yield health using SPC techniques to identify excursions and process drift. Present findings and recommendations to internal teams and customers using analytical tools.
Seniority
Mid-level IC