Process Engineer, APTD
Core
Optimizing automation, equipment, and process performance to improve product quality, reliability, and cost for next-generation semiconductor memory products.
Role type
Process Engineer (Semiconductor Packaging)
Builds
Scalable semiconductor packaging solutions and manufacturing capabilities
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Root cause analysis, Design of Experiments (DOE), Statistical Process Control (SPC), Defect analysis, Data analysis, Failure investigation (FMEA, 8D, FDC), Project management
Preferred skills
AI tools application, Automation development, Data-driven process improvement, Technology transfer support, Cross-functional collaboration
Technologies
DRAM, NAND, Semiconductor manufacturing equipment, Automation systems
Responsibilities
Optimize automation and process performance; Develop and enhance host/automation/data systems; Perform root cause analysis and failure investigations; Partner with equipment and process teams to implement new solutions; Support pilot line operations and technology transfer.
Seniority
Mid-level, hands-on IC
