CareerPlan

Intern - Advanced DRAM Cell & Device Technology

Boise, Idaho, United States of AmericaInternship2026-09-02 → 2026-11-10
Based in United States

Core

Develop and characterize next-generation DRAM cell and access device technologies through experimental studies, data analysis, and collaboration with multidisciplinary engineering teams.

Role type

Intern, semiconductor device engineer (DRAM)

Builds

Future memory technology solutions (DRAM cells, access devices, materials systems)

Domain

Semiconductor industry, memory technology, device physics

Required skills

Semiconductor device physics, materials science, electrical characterization, statistical analysis, Python/MATLAB/JMP scripting, DRAM operational concepts

Preferred skills

DRAM/NAND device development experience, thin film engineering, TCAD simulation, reliability mechanisms analysis, AI/LLM tools for engineering workflows

Technologies

Python, MATLAB, JMP, TCAD, AI-assisted engineering tools

Responsibilities

Evaluate DRAM access devices and cell stack elements via characterization and data analysis; Design and implement silicon experiments; Analyze device- and array-level behavior (sensing margins, retention, leakage); Collaborate with modeling, design, and manufacturing teams; Apply AI tools to enhance data analysis and decision-making

Seniority

Intern, academic researcher