Sr Advanced Packaging Technology Development Engineer, FILM process
Core
Drive HBM process development and yield improvement in FILMs (CVD, PVD) processes for advanced packaging (chip stacking, 2.5D/3D).
Role type
Senior IC process development engineer (advanced packaging/FILMs)
Builds
HBM memory solutions and advanced packaging structures
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Thin film deposition (CVD, PVD), Root cause analysis, Materials characterization, Process engineering (uniformity, stress, adhesion), Cross-team coordination, Supplier management
Preferred skills
PhD in Chemistry/Physics/Materials, Hands-on experience with AMAT/LAM/TEL tools, AI tool integration
Technologies
CVD, PVD, AMAT, LAM, TEL
Responsibilities
Drive HBM process development and yield improvement in FILMs process; Assist advanced package technology (chip stacking, 2.5D or 3D) research and development; Troubleshoot complex problems and perform root cause analysis; Coordinate mechanical characterization for advanced packaging development efforts globally; Review, summarize, and present data with recommendations of materials; Lead discussions with packaging material suppliers to meet technology roadmaps
Seniority
Senior, hands-on IC