Principal/MTS Vapor/Thermal Etch Development Engineer, Advanced DRAM Wet Etch
Core
Develop and integrate advanced thermal, vapor, and atomic layer etch processes for next-generation DRAM technologies.
Role type
Principal/MTS Process Development Engineer (Advanced DRAM Wet Etch)
Builds
Next-generation DRAM technologies
Domain
Semiconductor manufacturing / Advanced DRAM
Required skills
Thermal/vapor/atomic layer etch process development, Root-cause analysis, Thermodynamics, Gas-phase reactions, Transport phenomena, Reaction characterization, Cross-functional engineering leadership
Preferred skills
Statistical process control (SPC), Programming/scripting for data analysis and automation, AI-enabled tools for engineering workflows, AI-assisted analytics for yield improvement
Technologies
CVD, Diffusion, Lithography, CMP, Dry Etch, Metals
Responsibilities
Develop and integrate advanced thermal, vapor, and atomic layer etch processes; Lead feasibility studies, technical investigations, and root-cause analysis; Drive process roadmaps, technical readiness, and yield improvements; Collaborate with Process Integration, equipment development, and hardware vendors; Contribute to intellectual property development and evaluate emerging technologies
Seniority
Principal, hands-on IC with strategy & mentorship