OCT CPEE CMP STAFF/PRINCIPAL ENGINEER
Core
Lead and collaborate with multi-functional teams to develop Best Known Methods (BKMs) and drive improvements in Chemical Mechanical Polishing (CMP) processes and equipment for High-Volume Manufacturing (HVM).
Role type
Staff/Principal CMP Process & Equipment Engineer.
Builds
Process and equipment solutions for semiconductor memory and storage manufacturing.
Domain
Semiconductor manufacturing (CMP process/equipment).
Required skills
CMP process expertise, equipment solution development, global cross-functional collaboration, project prioritization, technical support for HVM sites, supplier partnership management.
Preferred skills
Attention to detail, professional supplier interfacing, flexibility for non-standard hours, travel readiness, interest in Agentic AI workflows.
Technologies
CMP equipment, semiconductor manufacturing tools.
Responsibilities
Lead worldwide alignment efforts to improve process effectiveness; Promote BKMs sharing and transfer of domain knowledge; Provide technical support to HVM sites for safety, productivity, cost, and yield initiatives; Partner with suppliers to develop process and equipment roadmaps; Prioritize and lead multiple projects based on Fab and corporate objectives; Keep collaborators informed of project status and roadblocks.
Seniority
Staff/Principal, hands-on IC with global leadership.
