CareerPlan

CMP Staff/Principal Engineer, Operation Central Team

Hiroshima, JapanFull-time2026-06-10 → 2026-11-13

Core

Lead global Chemical Mechanical Polishing (CMP) process and equipment strategies to improve manufacturing yield, cost, and quality across High-Volume Manufacturing sites.

Role type

Staff/Principal Process Engineer (CMP)

Builds

Process and equipment roadmaps, Best Knowledge Management (BKM) sharing, and continuous improvement initiatives for memory and storage manufacturing.

Domain

Semiconductor manufacturing (CMP process/equipment)

Required skills

CMP process expertise, equipment engineering, global cross-functional leadership, supplier partnership management, project prioritization, technical troubleshooting, safety compliance, yield improvement, cost optimization, productivity enhancement

Preferred skills

None stated

Technologies

CMP equipment, semiconductor manufacturing tools

Responsibilities

Lead worldwide alignment efforts to improve process effectiveness across technology nodes. Promote global sharing of Best Knowledge Management (BKM) and domain expertise. Provide hands-on technical support to HVM sites for safety, productivity, cost, and yield initiatives. Partner with suppliers to develop process and equipment roadmaps. Prioritize and lead multiple projects aligned with Fab and corporate objectives. Respond to manufacturing issues and communicate project status to stakeholders.

Seniority

Staff/Principal, hands-on IC with global leadership