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Engineer, DRAM PI

Boise, Idaho, United States of America💼 Full-time🗓 2026-09-09 → 2026-09-25

Core

Develop and integrate critical technology for future DRAM memory scaling, creating structural and electrical specifications for new process flows to serve AI-enabled customers.

Role type

Senior IC Process Integration Engineer (DRAM R&D)

Builds

Novel process flows, structural and electrical specifications, and design rules for next-generation DRAM modules

Domain

Semiconductor / Memory Technology / DRAM

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Device physics, Process integration, Statistical analysis, DOE (Design of Experiments), Yield enhancement, Cross-functional collaboration, Project milestone management

Preferred skills

PhD in Electrical Engineering or Physics, Semiconductor industry experience, Complex problem-solving in multi-tasking environments

Technologies

DRAM, NAND, NOR, SRAM memory technologies

Responsibilities

Engineer and develop novel process flows for critical modules; Utilize creative problem-solving to optimize process flows for performance and cost; Design experiments and analyze results using statistical software to enhance yield; Work cross-functionally with Design, Product Engineering, and Quality teams to resolve issues; Summarize complex problems and build consensus across teams to drive solutions; Define and achieve sub-milestones within overall program timelines; Collaborate with Manufacturing for technology transfer from R&D to production

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