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Design Architecture, Principal Engineer

Zhubei City, Hsinchu County, Taiwan💼 Full-time🗓 2026-08-10 → 2026-09-25

Core

Define next-generation AI memory and system environments by analyzing infrastructure trends, building performance models, and developing tooling for HBM architecture decisions.

Role type

Principal HBM Design Architecture Engineer

Builds

Simulation frameworks, first-order performance models, and trend dashboards for AI cluster performance and memory subsystem behavior.

Domain

Semiconductor manufacturing / High Bandwidth Memory (HBM) / AI Infrastructure

Deliverable

production ML models | product features

Required skills

HBM/DDR/cache memory subsystem design, hybrid computing systems analysis, Fab & Foundry experience, simulation framework development, performance modeling, stakeholder alignment

Preferred skills

Microelectronic manufacturing expertise, technical recommendation formulation, AI tool integration

Technologies

HBM, DDR, caches, AI-assisted tools

Responsibilities

Research and synthesize emerging trends in compute, networking, and storage; Lead HBM architecture analysis to define bandwidth/latency targets; Develop and maintain simulation frameworks; Build first-order performance models; Create and curate trend dashboards; Partner across teams to define architectural intercept opportunities

Seniority

Principal, hands-on IC

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