Metallization engineering lead
Core
Lead semiconductor process and equipment engineering for high-volume manufacturing, driving yield, performance, and operational excellence in a wafer fab environment.
Role type
Senior IC manufacturing engineering lead (semiconductor process/equipment)
Builds
High-volume memory and storage manufacturing lines
Domain
Semiconductor manufacturing (Wafer Fab/OSAT)
Required skills
Semiconductor process engineering, Equipment engineering, Yield management, Statistical Process Control (SPC), Process control, Equipment reliability, Team leadership, Cross-functional collaboration
Preferred skills
Advanced node experience, High-volume manufacturing (HVM), New site/ramp-up experience, Automation and data analytics
Technologies
Semiconductor equipment, SPC tools, Manufacturing execution systems
Responsibilities
Lead and develop a team of process/equipment engineers to support high-volume manufacturing, Drive process stability, yield improvement, and equipment performance, Own and execute continuous improvement initiatives (yield / cycle time / cost), Collaborate cross-functionally with production, quality, IE, and global teams, Coach and mentor team members to grow technical and leadership capabilities, Support new technology transfer / ramp-up / site expansion (via careerplan.io/jobs/41556829-metallization-engineering-lead-at-micron)