Senior Engineer - APTD Project Management
Core
Lead and manage Advanced Packaging Technology Development (APTD) projects and operations to deliver technology roadmap commitments on time.
Role type
Senior Engineering Project Manager (Semiconductor Manufacturing)
Builds
Advanced packaging technology builds, including wafer offloading, kitting, PWF, and assembly builds.
Domain
Semiconductor manufacturing, specifically Advanced Packaging Technology Development (APTD) and HBM.
Required skills
Project/Program Management, Technology Development, Operations Management, Process Engineering, Advanced Packaging flows, Risk Management, Stakeholder Management, Data Analysis, Manufacturing Execution Systems, SAP, Teamcenter.
Preferred skills
HBM experience, AI-assisted tools proficiency, Cross-functional leadership.
Technologies
SharePoint, Confluence, Power BI, Power Apps, SAP, Teamcenter, Manufacturing Execution Systems.
Responsibilities
Lead technology development programs and projects to deliver against go-to-market timelines; Develop and maintain integrated project schedules; Forecast build, material, cost, and resource requirements; Supervise daily execution including wafer offloading and assembly builds; Centralize and manage project documentation; Continuously improve technology development processes.
Seniority
Senior, hands-on IC
