Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Reliability)
Core
Define and develop reliability stress test flows and plans for HBM products, drive DPM reduction, and resolve root causes of device defects through failure analysis.
Role type
Senior/Staff/Principal Product Reliability Engineer (Semiconductor)
Builds
High Bandwidth Memory (HBM) products for data centers, AI, and 5G applications
Domain
Semiconductor manufacturing and reliability engineering
Required skills
Reliability test flow development, Root cause analysis (EFA/PFA), CMOS technology knowledge, DRAM architecture understanding, Data analysis and statistics, Python scripting, JMP usage, Cross-functional collaboration, Risk management, Process conversion strategy
Preferred skills
3+ years in semiconductor devices, circuit design, or product validation
Technologies
Python, JMP, CMOS, DRAM
Responsibilities
Define reliability stress test flows and plans, Manage qualification execution and gating issues, Drive DPM reduction via optimized test strategies, Debug and resolve defectivity and intrinsic reliability issues, Provide recommendations for fab process conversions, Manage risks associated with DPM process conversions, Mentor team members, Make technical decisions on risk analysis and project prioritization
Seniority
Senior/Staff/Principal, hands-on IC with mentorship responsibilities
