FE CPIE PI Principal/Staff Engineer
Core
Drive product maturity (yield, repair density, DPM) and process integration solutions across FEOL, MOL, CELL, and BEOL loops to resolve yield issues and enable fast yield ramp.
Role type
Principal/Staff Process Integration Engineer (FE CPIE PI)
Builds
Memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing (Memory/Storage)
Required skills
Process integration, Yield management, FEOL/MOL/CELL/BEOL knowledge, Cross-functional collaboration, Standardization, Travel
Preferred skills
Product and circuit design knowledge
Technologies
DRAM, NAND, NOR, FEOL, MOL, CELL, BEOL
Responsibilities
Drive best-in-class product maturity including bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning; Identify best optimum process integration solution to achieve goals; Collaborate with YE, Device, RDA, Metrology teams to resolve top yield issues; Identify best known method and business process from DRAM/NAND sites and drive for alignment and standardize across network; Travel to Micron sites as necessary for face to face collaboration.