Lead Engineer, 3D Integration & Advanced Packaging
Core
Lead a team to drive R&D of complex, multi-chip modules utilizing TSVs and microbumps for quantum processors operating at millikelvin temperatures.
Role type
Senior IC lead engineer (3D integration & advanced packaging)
Builds
Multi-chip quantum modules and 3D integrated circuits
Domain
Quantum computing hardware / Advanced semiconductor packaging
Required skills
3D integration, TSV design, microbump design, flip-chip bonding, multi-chip module design, thermal cycling management, yield improvement, failure analysis, foundry management, team leadership
Preferred skills
Cryogenic electronics, signal integrity simulation, solid-state quantum mechanics, materials behavior at extreme temperatures
Technologies
Ansys HFSS/Q3D, Cadence
Responsibilities
Recruit and mentor a high-performing team of packaging and integration engineers; Drive strategy and rapid prototyping of 3D integrated circuits; Ensure packaging architectures withstand thermal cycling down to millikelvin regimes; Own operations with external foundries and OSATs; Serve as the critical link between design, process integration, cryo R&D, and quantum hardware teams; Balance rapid R&D prototyping with yield improvement and reliability focus
