Firmware Engineering Intern
Core
Developing embedded C firmware for controlling DSP hardware in data center optical modules.
Role type
Firmware Engineering Intern
Builds
Networking PAM4 DSPs for 100G to 1.6T optical modules used in cloud data centers.
Domain
Semiconductor / Networking / Data Infrastructure
Required skills
C programming, Python, embedded firmware development, micro-controller architecture, networking fundamentals (PHY to data link), Linux, bash scripting, git, debugging
Preferred skills
ARM or RISC-V architecture knowledge, DSP concepts (equalizers, filters, ADC, DAC, FFE, DFE), PAM modulation, multi-core MCU optimization, Jenkins, GUI development
Technologies
C, Python, Linux, Windows, Jenkins, git, gdb, makefiles, bash
Responsibilities
Develop embedded C firmware for DSP hardware, write C & Python test code for utilities and regression, debug difficult issues with HW/SW teams, optimize subroutines for multi-core MCUs, manage firmware release cycles
Seniority
Intern
