Firmware Engineering Intern
Core
Developing embedded C firmware for controlling DSP hardware in 100G to 1.6T optical modules for cloud data centers and AI clusters.
Role type
Firmware Engineering Intern
Builds
Embedded firmware, test utilities, GUIs, and simulation infrastructure for networking PAM4 DSPs
Domain
Semiconductor / Networking / Optical Communications
Deliverable
production ML models | product features | infrastructure
Required skills
C programming, Python, micro-controller architecture fundamentals, networking fundamentals (OSI model PHY to data link), processor-memory-peripheral interaction, software development lifecycle, regression testing, Linux/Windows development, CI/CD (Jenkins), bash scripting, git
Preferred skills
ARM/RISC-V architecture knowledge, DSP concepts (equalizers, filters, ADC, DAC, FFE, DFE), PAM modulation, embedded firmware environment experience, Jira/SCM/IDE usage
Technologies
C, Python, Linux, Windows, Jenkins, git, bash, make, gdb, ARM, RISC-V
Responsibilities
Develop embedded C firmware for DSP HW control, write C & Python test code for utilities and regression, debug difficult issues with HW/SW teams, optimize subroutines for multi-core MCU architecture, manage firmware release from concept to customer
Seniority
Intern
