Summer 2027 - Technology Development Intern
Core
Summer 2027 internship for engineering students to develop new processes, qualify materials/equipment, and troubleshoot issues for CMOS Image Sensor, 65nm CMOS BCD, or Advanced Packaging teams.
Role type
Summer 2027 Technology Development Intern
Builds
New technology processes for ramp to volume manufacturing
Domain
Semiconductor manufacturing (300mm)
Required skills
Process development, material qualification, equipment troubleshooting, yield improvement, safety compliance
Preferred skills
Lab equipment proficiency (oscilloscope, probes, power supplies, mechanical tools)
Technologies
300mm wafer fab, CMOS Image Sensor, 65nm CMOS BCD, Advanced Packaging
Responsibilities
Develop new processes or control plans; Evaluate and qualify new materials, processes, and equipment; Troubleshoot process issues and implement corrective actions to improve yield and device performance; Ensure compliance with safety and quality standards
Seniority
Intern