Unit Process Development Engineer
Core
Design and optimize SiC power etch processes to ensure manufacturability, cost competitiveness, and high quality for wide bandgap technologies.
Role type
Senior IC process development engineer (dry etch)
Builds
SiC power devices and modules
Domain
Semiconductor manufacturing (wide bandgap)
Required skills
Dry etch process development, process integration, process characterization, reliability analysis, yield improvement, defect reduction, tool capability optimization, cross-functional team leadership, technology ramp management
Preferred skills
Advanced degree in semiconductor processing or device physics, experience with 8-inch fab, experience with 0.25 um technology, experience leading remote factory teams
Technologies
8-inch fab, 0.25 um technology, wide bandgap technologies, Bucheon Korea manufacturing facilities
Responsibilities
Develop capable processes fitting unified technology design rules, ensure complete process characterization for monitoring and reliability, participate in due diligence for wide band gap products, own process development and qualification, improve yield and cost through process window optimization, improve tool capability via collaboration on continuous improvement projects
Seniority
Senior, hands-on IC