Senior NPI Engineer
Core
Introduce and maintain assembly processes to transfer, qualify, and ramp up new product/package/technology into manufacturing.
Role type
Senior NPI Engineer (Semiconductor Packaging)
Builds
New product/package/technology transfers and production setups for semiconductor manufacturing
Domain
Semiconductor manufacturing and packaging
Required skills
Assembly process engineering, Design for Manufacturability, Root cause analysis, Risk assessment, DOE, SPC, DFMEA, Material selection, Equipment selection, Cost competitiveness analysis, Yield improvement, Stability improvement, Quality improvement, Cross-functional collaboration
Preferred skills
Semiconductor or silicon/silicon carbide wafer processing experience, Power module packaging experience, Chip package (CPI) experience, Data analysis using JMP/Minitab/Power BI
Technologies
AutoCAD, 8D, SPC, DFMEA, DOE, JMP, Minitab, Power BI, Epoxy Molding Compound, Direct Bond Copper Ceramic