CareerPlan

Senior NPI Engineer

Dong Nai, Viet NamFull-time2026-10-01 → 2026-11-10

Core

Introduce and maintain assembly processes to transfer, qualify, and ramp up new product/package/technology into manufacturing.

Role type

Senior NPI Engineer (Semiconductor Packaging)

Builds

New product/package/technology transfers and production setups for semiconductor manufacturing

Domain

Semiconductor manufacturing and packaging

Required skills

Assembly process engineering, Design for Manufacturability, Root cause analysis, Risk assessment, DOE, SPC, DFMEA, Material selection, Equipment selection, Cost competitiveness analysis, Yield improvement, Stability improvement, Quality improvement, Cross-functional collaboration

Preferred skills

Semiconductor or silicon/silicon carbide wafer processing experience, Power module packaging experience, Chip package (CPI) experience, Data analysis using JMP/Minitab/Power BI

Technologies

AutoCAD, 8D, SPC, DFMEA, DOE, JMP, Minitab, Power BI, Epoxy Molding Compound, Direct Bond Copper Ceramic