Summer 2027 - Thin Films, Implant & Diffusion Process Engineering Intern
On-siteNo visa sponsorship
Core
Intern role focused on defining, developing, and implementing manufacturing processes for integrated circuits within the thin films, implant, and diffusion domains.
Role type
Summer 2027 Process Engineering Intern (Semiconductor Manufacturing)
Builds
Integrated circuit manufacturing processes
Domain
Semiconductor / Wafer Processing
Required skills
Semiconductor engineering fundamentals, statistical data analysis, laboratory characterization, problem-solving, cross-functional collaboration
Preferred skills
Experience with wafer processing classes
Technologies
None explicitly stated
Responsibilities
Collaborate with engineering teams to develop, improve, and execute process improvements; Review and optimize standards and documentation; Investigate and resolve real-world manufacturing challenges
Seniority
Intern