New Product Introduction
Core
Introduce and maintain assembly processes to ensure manufacturing and quality requirements are met for new products, packages, and technologies.
Role type
Senior IC manufacturing engineering lead (semiconductor packaging)
Builds
New product/package/technology transfers, production setups, and volume ramp-ups for semiconductor power modules and chip packages
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Assembly process engineering, Design for Manufacturability, risk assessment and mitigation, root cause analysis, material and equipment selection, Lean Six Sigma, DOE, SPC, DFMEA, 8D reporting
Preferred skills
Semiconductor or silicon/silicon carbide wafer processing, data analysis with JMP/Minitab/Power BI, thermosetting plastic knowledge
Technologies
AutoCAD, JMP, Minitab, Power BI, DOE, SIPOC, Lean Six Sigma
Responsibilities
Transfer, qualify, and ramp-up of new product/package/technology; troubleshoot qualification failures and method issues; define BOM selection and process flow; drive improvement projects for stability, yield, cost, and quality; implement new products from engineering build to manufacturability environment
Seniority
Senior, hands-on IC
