External Manufacturing NPI Engineer
Core
Lead backend external manufacturing NPI from conceptualization through production launch for new semiconductor packages and complex derivative platforms.
Role type
Senior IC manufacturing NPI lead (technical lead with team management)
Builds
New product industrialization, assembly readiness, and production ramp for semiconductor IC packages
Domain
Semiconductor manufacturing (backend), IC packaging, OSAT operations
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (manufacturing launch & ramp)
Required skills
NPI process management, DFM, technology & manufacturability readiness, OSAT partnership management, production ramp management, risk analysis & mitigation, process characterization, CIP development, yield improvement, DOE characterization, SPC, failure analysis, statistical analysis, project management, cross-functional collaboration
Preferred skills
SiC, GaN, CIS Imaging assembly process expertise, Chip-to-Package Interaction (CPI) knowledge, IC package design/CAD/simulation/characterization, Mandarin language proficiency
Technologies
PLM, CAD, DOE, SPC
Responsibilities
Own backend external manufacturing NPI lifecycle, interface and steer cross-functional teams, drive DFM and manufacturability readiness, partner with OSATs for assembly readiness, manage production ramp and safe launch, establish Best Known Methods, participate in quality audits, drive continuous yield improvement, manage a 5-6 person team
Seniority
Senior, hands-on IC with team management
