New Product Introduction Engineer
Core
Introduce and maintain assembly processes to ensure manufacturing and quality requirements are met for new products, packages, and technologies.
Role type
New Product Introduction Engineer (Semiconductor Packaging)
Builds
New product/package/technology transfers, production setups, and volume ramp-ups for semiconductor power modules and chip packages.
Domain
Semiconductor manufacturing and packaging
Required skills
Assembly process engineering, Design for Manufacturability, risk assessment and mitigation, root cause analysis, material and equipment selection, project leadership, statistical analysis
Preferred skills
Semiconductor or silicon/silicon carbide wafer processing, data analysis
Technologies
AutoCAD, 8D, SPC, DFMEA, DOE, JMP, Minitab, Power BI
Responsibilities
Transfer, qualify, and ramp-up of new product/package/technology; define risk assessment and mitigation plans; perform technical gap analysis and cost competitiveness evaluation; troubleshoot qualification failures; select materials and equipment to meet quality and yield targets; drive improvement projects for stability and cost.
Seniority
Mid-to-Senior, hands-on IC