Wire Bond & Die Attach Equipment Engineer (MES Project)
Core
Drive digital transformation of Wire Bond and Die Attach lines by implementing Manufacturing Execution Systems (MES) and transitioning to optimize equipment uptime and automation.
Role type
Senior IC equipment engineer (semiconductor manufacturing)
Builds
MES-integrated wire bond and die attach production lines
Domain
Semiconductor manufacturing
Required skills
Wire Bond equipment expertise, Die Attach equipment expertise, MES implementation, semiconductor manufacturing knowledge, SPC techniques, cleanroom protocol, equipment maintenance, data collection, equipment interlocks, UAT leadership
Preferred skills
ASM equipment experience, KNS equipment experience, Siemens OpCenter experience, PAC integration knowledge, tool monitoring software experience
Technologies
Siemens OpCenter, PAC systems, MES platforms
Responsibilities
Define equipment-specific workflows and qualification requirements for MES rollout, translate shop-floor requirements into digital process designs, validate equipment integration scenarios and lead UAT, manage equipment reliability and troubleshoot MES-related issues in production
Seniority
Senior, hands-on IC