Junior Die Attach/Die Bond Equipment Technician
Core
Perform preventative maintenance, repairs, improvements, upgrades, and installation of die attach/die bond equipment to ensure process requirements are met.
Role type
Junior Equipment Technician (Die Attach/Die Bond)
Builds
Semiconductor manufacturing equipment and tooling
Domain
Semiconductor manufacturing / Electronics
Deliverable
infrastructure
Required skills
Preventative maintenance, equipment repair, equipment upgrades, equipment installation, data analysis, supplier coordination, technical reporting
Preferred skills
Electrical troubleshooting, mechanical troubleshooting, analytical thinking, problem solving, time management
Technologies
Die attach/die bond equipment
Responsibilities
Perform preventative maintenance, equipment repairs, equipment improvements, equipment upgrades, and equipment installation; Monitor and analyze data to improve tool performance; Coordinate supplier service and repairs; Prepare technical reports and recommend solutions
Seniority
Junior, entry-level (fresh graduates to 2 years experience)