Senior IC/MEMS Integration and Simulation Engineer
Core
Design microbolometer MEMS architecture and electrical/mechanical interfaces with ROIC for thermal imaging sensors.
Role type
Senior IC/MEMS Integration and Simulation Engineer
Builds
LWIR thermal imaging sensors for drones, vehicles, and robotics
Domain
Defense technology / Semiconductor / MEMS
Required skills
IC layout design, FEA simulation, MEMS pixel structure knowledge, ROIC pad/bump interface understanding, hybrid integration constraints
Preferred skills
Microbolometer/IR sensor experience, wafer-level/die-level hybrid bonding, JEDEC packaging formats, wire-bond/bump interconnect design
Technologies
ANSYS, COMSOL
Responsibilities
Design microbolometer layout and RDL to align pixel attachment points with ROIC pads, run FEA models for mechanical behavior and structural integrity, simulate thermal behavior across packaging cycle to flag stress/delamination risks, feed simulation results into layout and process decisions, maintain design documentation and simulation records
Seniority
Senior, hands-on IC
