Staff Backend and Test Engineering
Core
Staff Backend and Test Engineering responsible for UHP and HPL laser backend assembly, test, and AOI in new chip product introduction, production ramp, and yield sustaining/improvement in foundries.
Role type
Staff Backend and Test Engineering
Builds
UHP and HPL laser assembly, test, and AOI equipment for production and yield improvement
Domain
Semiconductor manufacturing / High Power Laser
Required skills
statistical data analysis, root cause analysis, process vs product parameter correlation, failure analysis, yield improvement, equipment bring-up, engineering material disposition
Preferred skills
NPI experience, foundry collaboration, RMA handling
Technologies
UHP lasers, HPL lasers, AOI equipment, wafer acceptance test systems
Responsibilities
Bring up UHP and HPL laser assembly, test, AOI equipment to support production and yield improvement; Perform statistical data analysis and troubleshoot yield excursions; Run process vs product parameter correlation to drive improvement; Detect Fab excursions early using test data; Coordinate with R&D, Product Engineering, and contract manufacturers for field failure response; Conduct failure analysis for NPI and sustaining products and RMAs; Manage engineering material disposition at wafer acceptance test.
Seniority
Staff, hands-on IC