Director, Back-End Engineering
Core
Lead Back-End (BE) Engineering team to support ultra-high-speed Laser Chip mass production for Mega Data Centers and AI/ML applications.
Role type
Director, Back-End Engineering
Builds
State-of-the-art Laser Chip production lines (20-30 million pcs/quarter)
Domain
Semiconductor manufacturing / Optical devices
Deliverable
production ML models
Required skills
BE technology, Fab operation, process setup, yield improvement, capacity ramp-up, KPI metrics (CT, TAKT, LT), strategic planning (KAIZEN, Capex)
Preferred skills
Manager class experience in Semiconductor Fab or Chip design/process development for semiconductor optical devices
Technologies
Laser Chip, Fab operation tools
Responsibilities
Lead Fab operation support for huge volume Laser Chip Mass Production line; Drive chip production line process setup and aggressive improvement; Execute yield improvement and capacity ramp-up strategies; Deploy effective KPI metrics to improve BE production line efficiency
Seniority
Director, strategic leadership & hands-on management
