Component Engineer
Required skills
BSME/BSEE or equivalent, 3–5+ years of experience supporting the introduction of new products, Hands-on experience with interconnect and connector technologies at the application and component level, fundamentals of associated PCB attach technologies, ability to contribute to cross-functional teams, Working knowledge of mechanical and electrical design principles, tolerance analysis, fabrication methods, materials selection, plating, and validation testing, familiarity with Signal Integrity (SI) fundamentals, Solid project management skills.
Preferred skills
Familiarity with system-level design of networking equipment, ability to translate system requirements into interconnect-level specifications, Awareness of thermal management and liquid cooling considerations, Experience supporting supplier relationships, Exposure across key areas of the interconnect commodity space, Competency in SPC, FMEA, 8D / Corrective Action, Cause-and-Effect Analysis, Design of Experiments (DOE), and risk assessment, Experience with high-speed cable assemblies, Prior manufacturing-facing experience.
Technologies
interconnect components, connectors, PCB attach technologies, Signal Integrity (SI), thermal management, liquid cooling, coolant cables, cold-plate, leak detection, thermal interface materials (TIM), active cooling connectors, high-speed cable assemblies.
Responsibilities
evaluate and qualify interconnect components, optimize signal integrity, mechanical robustness, reliability, and overall system performance, comply with industry standards and regulatory requirements, contribute to cross-functional efforts to evaluate, down-select, and qualify connectors and interconnect components, partner with suppliers to validate interconnect behavior from concept through NPI, ensure components are technically sound, reliable, and cost-effective.
Seniority
Mid-level (3–5+ years of experience).
Domain
Semiconductor and systems design, interconnect engineering, component engineering, supply chain management.
