Materials Engineer
Core
Drive material selection, sourcing, and characterization for adhesive and interconnect materials used in semiconductor packaging and module assembly.
Role type
Materials Engineer (Semiconductor Packaging)
Builds
Electrical and optical modules and packaging
Domain
Semiconductor manufacturing / Materials Science
Required skills
Adhesive and interconnect material selection, Material characterization (DMA/TMA/DSC/Rheometer/TGA/Universal tester), New material sourcing, Issue analysis during characterization
Preferred skills
Adhesive material formulation, Material level characterization methodology development, Correlation of material properties with module performance