Photonic Packaging Engineer
Core
Design, develop, and support next-generation packaging platforms for Cisco's Silicon Photonics Integrated Circuits and chipsets, focusing on electromechanical assemblies and automated manufacturing tools.
Role type
Senior IC photonic packaging engineer
Builds
Critical optical components, processes, and tools for high-volume manufacturing platforms
Domain
Semiconductor manufacturing / Silicon Photonics
Deliverable
production ML models | product features | physical/clinical work
Required skills
Hardware/process automation, electromechanical assembly design, data analysis (SQL/JMP), C#/.NET development, photonics/fiber optics/semiconductor lasers knowledge
Preferred skills
Machine vision in automation, AI/ML for diagnostics and edge case stimulation
Technologies
C#, .NET, SQL, JMP, AI/ML frameworks
Responsibilities
Design and test prototypes of complex electromechanical assemblies for automated tools; analyze data from automated packaging tools to improve novel subassemblies; implement test/assembly/process improvements to reduce cycle time and automate systems; apply analytics and AI/ML to optimize diagnostics and problem detection; partner with hardware, software, and manufacturing teams for multi-functional alignment; mentor teams in diagnostics, data engineering, and AI-assisted development
Seniority
Senior, hands-on IC with mentorship responsibilities
