Photonic Packaging Engineer
Required skills
Bachelors + 7 years of related experience, or Masters + 4 years of related experience, or PhD + 1 year of related experience Hardware/process automation experience
Preferred skills
Experience in hardware/software automation of photonics assembly/test. Experience with machine vision in an automation environment. Data analysis (SQL/JMP) in a semiconductor production environment. Software development using C# on .NET. Knowledge of photonics, fiber optics and semiconductor lasers
Technologies
C#, .NET, SQL, JMP, machine vision, AI/ML
Responsibilities
Provide engineering support for Cisco’s internally developed photonic assembly packaging tools. Gather and analyze data from Cisco’s automated packaging tools/processes to shape new projects targeting improvement in novel subassemblies used in Cisco-designed high-volume manufacturing platforms. Recommend and implement test/assembly/process improvements, including cycle time reduction and automation of system to minimize required operator time and intervention. Design, build, and test prototypes of critical, complex electromechanical assemblies to be used in automated manufacturing/test tools. Follow new tools, processes, and components from development to production to ensure successful integration of new platform technologies. Apply analytics and AI/ML to stimulate edge cases, optimize strategies, improve coverage, usability, debug capabilities and problem detection using structured problem-solving methodologies. Partner with hardware, software, and manufacturing teams to ensure multi-functional alignment and successful transition to manufacturing. Develop and execute project plans with predictability, quality and velocity. Collaborate and travel to assure successful product deployment across a global environment. Mentor and develop high-performing teams, emphasizing continuous learning in diagnostics, data engineering, advanced analytics, and effective use of AI-assisted development tools
Seniority
Not specified
Domain
Semiconductor, Photonics, AI/ML, Automation, Manufacturing