Principal Equipment Engineer (Multiple Positions) #9938
Core
Retrofit component and parameter settings to improve tool performance and availability for diffusion, thin film, lithography, or etching equipment in a clean room environment; install and qualify new tool sets to add capacity.
Role type
Principal Equipment Engineer (Semiconductor Manufacturing)
Builds
Semiconductor chips using leading-edge process technologies (N4, N3, N2, 2nm)
Domain
Semiconductor manufacturing / Hardware engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor manufacturing principles and techniques, Hardware control methods, Mechanical systems (robotics, pneumatics, electrical systems), Physics and chemistry principles for lithography, Root cause analysis for hardware defects, Team leadership
Preferred skills
Experience with 5nm technology or beyond, Experience overseeing junior engineers
Technologies
Lithography track equipment, Diffusion tools, Thin film tools, Etching equipment
Responsibilities
Solve critical equipment issues to improve uptime and utilization efficiency, Implement best known hardware methods to control tool performance, Identify opportunities for hardware capability enhancement to drive defect reduction, Communicate with cross-function engineers, vendors, facilities, and manufacturing shift personnel
Seniority
Principal, hands-on IC with mentorship responsibilities