Principal Equipment Engineer (Multiple Positions) #9938
Core
Retrofit component and parameters settings to improve tool performance and availability for diffusion, thin film, lithography or etching equipment in a clean room environment. Install and qualify new tool sets according to planned schedules, to add capacity in a timely manner.
Role type
Principal IC equipment engineer (semiconductor manufacturing)
Builds
Semiconductor manufacturing tools (diffusion, thin film, lithography, etching)
Domain
Semiconductor manufacturing / Hardware engineering
Required skills
Semiconductor manufacturing principles and techniques, 5nm technology or beyond experience, mechanical systems knowledge (robotics, pneumatics, electrical systems), physics and chemistry principles for lithography, troubleshooting complex defect and hardware issues, hardware capability enhancement, root cause analysis
Preferred skills
Experience overseeing junior engineers
Technologies
Semiconductor lithography track equipment, robotics, pneumatics, electrical systems
Responsibilities
Solve critical equipment issues to improve tool uptime availability and utilization efficiency, Implement best known methods in hardware to control tools performance and utilization, Identify and pursue opportunities for hardware capability enhancement, Communicate with cross-function engineers or vendors and serve as a module liaison
Seniority
Principal, hands-on IC with mentorship